Study of the mechanical and thermal properties of Sn–5 wt% Sb solder alloy at two annealing temperatures

Abstract

Sn–5 wt% Sb alloy is one of the materials considered for replacing lead-containing alloys for soldering in electronic packaging. Differential thermal analysis (DTA) and specific heat of the sample were studied. Wetting contact angle measurements of the alloy on different substrates were carried out at high temperature. Microhardness tests as a function of temperature were performed to calculate the effective activation energy of the solder alloy Sn–Sb and compared with the pure elements Sn and Sb. Isothermal creep curves for alloy samples were obtained under different constant applied stresses at different working temperatures ranging from 463 K to 503 K, followed by annealing the samples at two different temperatures before and above the threshold value (Tm/2). The transient creep parameters and the values of the stress exponent n were calculated for the two annealing temperatures. Microstructure examinations of the as-cast alloy at room temperature and after the two annealing treatments with the effect of the cold work deformation and creep test on the structure change and properties of Sn–Sb alloys were reported. The stress rupture test was also measured.