Abstract

Dielectric loss peaks caused by thermal imidization were observed for the three complexes of benzophenonetetracarboxylic acid dimethyl ester (BZPE) with different diamines. The mechanism of the formation of imide rings from complexes with hydrogen bonds and with separated charges was specified. The specific features of thermal imidization of the BZPE·diaminopyridine dimeric complex were confirmed and it was shown that heat treatment of the complex of BZPE with hexamethylenediamine yields a softening polyimide and thermal imidization takes place at lower temperatures.

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