Study of the Effect of Fin Geometry on Cooling Process of Computer Microchips Through Modelling and Simulation

Abstract

Increase in computer processing speed and power results in an increase in heat flux dissipation, this necessitates higher transistor densities to reduce the path that a signal needs to travel, which in turn lead to the use of multichip modules, (arrays of chips placed on one substrate). In this study MATLAB, programming language was used to model the effect of fin geometry on cooling process of computer microchips. The fin geometries used in the study were pin fin, rectangular fin and triangular fin for Aluminium, Copper, Beryllium and Zinc as material of construction. From the results obtained at Multi Chip Module (MCM) power (which ranges from 500 to 900 watt) and the maximum chips surface temperature maintained at 90°C, triangular spine fin geometry exhibited higher heat dissipation per unit volume, higher heat dissipation efficiency and higher maximum heat loss per number of fins as compared to the pin and rectangular spine fin geometry. The results of the study will help heat sink designer in taking decision on the best fin geometry to be used for computer microchips application for a specific MCM power.