Abstract
We perform molecular dynamics simulations to understand the melting mechanism in Cu crystals (modeled using Embedded Atom Potential) with spherical voids of radii 0.5, 0.6 and 1.0 nm. Along with these systems defect-free Cu and a Cu crystal with layered void is also studied. We analyse crystallinity in these systems using Q6 bond-orientational order parameter, Lindemann index, radial distribution functions and coordination numbers. At 1 atm, all crystals melt between 1700 and 1800 K and melting temperature decreases with increase in void fraction. It is also found that at 900 K voids disintegrate and become a part of the crystal and between 900 and 1700 K crystals amorphize losing long-range order.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
