Study of Solder Joint Intermittent Fault Diagnosis Based on Dynamic Analysis

Abstract

For intermittent fault diagnosis, it is important to extract fault features. Since different package modes have different dynamic characteristics, an intermittent fault diagnosis method based on the dynamic analysis of solder joints is proposed. First, solder joint intermittent fault dynamic models of different packaging modes are constructed, and the dynamic response characteristics of intermittent faults are analyzed based on the dynamic model. The intermittent fault characteristics of different packaging solder joints are proven to be different using the intermittent fault dynamic theoretical model. By analyzing the intermittent fault parameters, the generalized strength of intermittent faults is constructed as the intermittent fault feature to diagnose intermittent faults for different package modes. Next, combining the above dynamic analysis conclusions with the characteristics of intermittent fault parameters, it is possible to determine the location of the intermittent faults. Finally, two solder joint intermittent fault experiments under vibration are carried out, and the intermittent fault features are calculated by analyzing the intermittent fault time-domain signals. The results show that the dynamic-based intermittent fault diagnosis method enables intermittent fault diagnosis of solder joints in different package modes.