Study of silicon surface passivation by ZnOx/AlOx stack prepared using super-cycle approach in thermal ALD process

Abstract

High quality surface passivating films are essential for high efficiency solar cells. In this work, we present our study about the silicon surface passivation performance of thermal atomic layer deposited (T-ALD) ZnOx/AlOx stack deposited using super-cycle approach. Super-cycle approach is composed of three cycles of DEZ-DI water system followed by one cycle of TMA-DI water system. The number of super-cycles is varied to change the film thickness. Excellent passivation with surface recombination velocity ∼ 7 cm/s was achieved under this study for hydrogen annealed films. The passivation mechanism is related to the saturation of defects by hydrogen after annealing and further improvement in fixed oxide charges by one order of magnitude (1010 to 1011 cm−2). Hydrogenation at the optimum temperature (450⁰C) involves the transport of hydrogen atoms towards the interface and their interaction with dangling bonds at the Si surface leading to the effective passivation. The optical transmittance of the film in the visible region of the spectrum is found to be >95 % for all the deposited films. XPS data reveals that deposited films are Al rich which is possible due to ligand exchange reactions during the growth process. Annealing of ZnOx/AlOx stacks in hydrogen ambient and their Al-rich behavior helps in the realization of good passivation performance. XPS study also shows that Al-O bond improves with film thickness. According to valence band spectra, a relative shift in Fermi level position with regard to the valence band improves band bending, which improves field effect passivation. Such high-quality ZnOx/AlOx passivating films may improve the device efficiency.