Abstract
Lead-free solders have become a main focus of the electronic industry in recent years, because of the high toxicity of lead. Alloys based on the Sn-Bi system figure as potential replacements for Sn-Pb alloys in soldering due to favorable properties and low cost. One of the main advantages of these alloys are low melting temperatures, while additional advantages include good compatibility with substrates, low process temperature, high reliability, and potential applications in conjunction with reduced graphene oxide nanosheets as thermal interface materials. In this paper, characterization of microstructural and thermal properties as well as hardness measurements of seven alloys of different Sn-Bi compositions are performed. Structural properties of the samples were analyzed using optical microscopy and scanning electron microscopy and energy dispersive X-ray spectroscopy (SEM-EDS). Thermal conductivity of the samples was investigated using the xenon-flash method, and phase transition temperatures were measured using the differential scanning calorimetry (DSC) analysis.
Highlights
For a long time, lead-tin alloy was broadly used in electronic industry because of its favorable physical and mechanical characteristics, and wellstudied and optimized production [1]
Lead-free solders have become a main focus of the electronic industry in recent years, because of the high toxicity of lead
Lead-tin alloy was broadly used in electronic industry because of its favorable physical and mechanical characteristics, and wellstudied and optimized production [1]
Summary
Lead-tin alloy was broadly used in electronic industry because of its favorable physical and mechanical characteristics (low melting point, good wettability on different substrates, high strength of joints), and wellstudied and optimized production [1]. A considerable number of investigations have been devoted to examining microstructure and mechanical properties of Sn-Bi alloys with addition of alloying elements such as Ni, Cu, Zn, Ag [5,6,9,10,11,12,13,14] These systems with addition of other components have been researched because of their potential application as thermal interface materials (TIM). This work focused on microstructure characterization, hardness measurements, and thermal properties investigations as a contribution to more complete knowledge of the mentioned system These investigations included determination of thermal diffusivities and thermal conductivities of seven Sn-Bi alloys with different compositions
Sign-in/Register to view highlights & summary Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
