Abstract

The hot-electron-induced interface state generation in thin (˜8.6nm) oxynitride films prepared by rapid thermal reoxidation (RTO) of rapidly thermal nitrided (RTN) SiO2 have been studied. Both MOS capacitors and MOSFETs were used as testing devices. For MOSFETs, charge-pumping current Icp measurement was performed to monitor the increase ΔDit of interface state density. It is found that the optimised RTN and RTO processes could produce devices with a significantly improved resistance against the hotelectron- induced interface state generation.

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