Abstract
Polyimide (PI) films coated on Cu films were treated under a high humidity condition. FT-IR RAS measurements have clarified the interface reactions of Cu with PI, the hydrolysis of imide functional group and formation of Cu carboxylate. From the calculation of RAS spectra measured at various incident angles, the diffusion of Cu carboxylate was confirmed from interface to the surface of PI. The diffusion length of Cu carboxylate ranges about 1 μm from Cu interface. The RAS result coincides with the ATR depth profile result and TEM-EDX image. Transmission electron microscope (TEM) images show that Cu diffuses mainly into the Cu carboxylate formation under our high humidity condition.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
