Abstract
Drift-diffusion models are used in conjunction with Monte Carlo simulations to study and compare the scalability of germanium (Ge) versus silicon (Si) p-channel double-gate MOSFETs near the end of the technology roadmap. Direct source-to-drain tunneling (DSDT) and uniaxial compressive stress effects are taken into account. The higher dielectric constant of Ge results in degraded short-channel effects and lower drive currents for a given off-state leakage specification. With large compressive uniaxial channel stress (1.5 GPa), Ge can outperform Si for gate lengths (Lg) greater than 15 nm. Due to its lower effective hole transport mass, Ge suffers more from DSDT, resulting in degraded p-channel MOSFET performance at very short Lg.
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