Study of Enhanced Gravity Separation Based on Liberation Characteristics of a Heat-Treated Circuit Board

Abstract

This study compared particle size distribution and density distribution of crushed products for waste printed circuit boards (WPCBs) before and after heat treatment. The crushing process for heat-treated WPCBs is a selective crushing process; more metal is concentrated in the coarse particle range of 1.0–0.5 mm and high density range of 2.8–2.96 g/cm3. WPCBs were separated using the Falcon separator to recycle useful metals. The Box-Behnken module of Design-Expert was used to obtain optimal separation parameters, namely, rotational frequency of 25 Hz, recoil water pressure of 0.025 Mpa and feed speed of 34 ml/s. On this basis, the separation indexes for WPCBs with and without heat treatment were compared. Experimental results show that the recovery effect is better for heat-treated WPCBs than for those without heat treatment. Compared with the non-heat-treated WPCBs, the product grade of heat-treated WPCBs is 1.95% higher, and its recovery is improved by about 14%. Finally, characteristics of WPCBs before and after heat treatment were analyzed on the basis of stress experiments and scanning electron microscopy (SEM), respectively. Results of mechanical characterization indicate that the stress experiment for non-heat-treated WPCBs has a maximum pressure load of 212 N and displacement of 20 mm, but heat-treated WPCBs only need 140 N stress and 14 mm displacement. SEM shows that copper foil and fiberglass cloth are deformed in different directions and sizes after heat treatment to form gaps, which promote liberation of copper foil and fiberglass cloth.