Abstract
Abstract Quality and reliability of any solder joint depends on the interfacial morphology and distribution of the intermetallic compounds (IMCs) across the solder joint interface. In the present work, author shows the changes in microstructures and resistivity of the solder joints prepared with SN100C solder paste along with thin Sn film as interlayer using Cu pad as substrate. The micro-structural observations and the resistivity study of the samples with aging time were carried out by the optical microscope and 4 probe Source Measuring Unit (SMU) respectively. Result establishes the fact that the resistivity could be controlled by the addition of layers like Sn. It is also reported that the addition of Sn interlayer changes the microstructure and lowers the growth of the intermetallic compounds at the interface of the solder joint. It is concluded that, if alternate layers of Sn and solder paste (SN100C) are arranged, then the reliability and the performance of the soldered components will improve greatly and hence shall increase the service life of the gadgets.
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