Study of dynamic recrystallization behavior of T2 copper in hot working conditions by experiments and cellular automaton method

Abstract

The dynamic recrystallization (DRX) behavior of T2 copper was studied by experiments and cellular automaton (CA) simulation during hot compression. The hot compression deformation of T2 copper was performed by isothermal hot compression tests over a wide range of temperatures (400–900 °C) and strain rates (0.001–10 s−1). The experimental results show that the deformation temperatures and strain rates have a profound influence on the DRX behavior. The characteristic parameters for the DRX behavior of T2 copper were obtained and a DRX kinetics model based on the modified Avrami equation was proposed to describe the DRX behavior of T2 copper. The average DRX grain size of the copper was estimated on the basis of metallography observation, and a power law function of Zener-Hollomon parameter was established to predict the grain size under different deformation conditions. A mesoscopic cellular automaton model was established to simulate the DRX behavior of T2 copper. The comparison between experimental and simulation results indicates that the recrystallization fraction and the average DRX grain size can be accurately predicted by the present CA model. It suggests that the developed CA model can be used to take control of the DRX process for the copper during hot working.