Abstract
The graphene is used to enhance the thermal conductivity, but it is difficult to obtain uniform dispersion and low dielectric property. We fabricate the polyimide composite with high thermal conductivity and low dielectric property. It changes the filler contents, and examines curing time and dispersion. The dispersion characteristics were quantified by absorbance measurement. The graphene 0.1 wt% and BN 0.5 wt% polyimide composites show a thermal conductivity of 6.6 W/m®K by LFA (Laser Flash Analysis) and a dielectric constant of 4.6@10 GHz by SPDR (Split Post Dielectric Resonators).
Highlights
The dispersion characteristics were quantified by absorbance measurement
The graphene 0.1 wt% and BN 0.5 wt% polyimide composites show a thermal conductivity of 6.6 W/m·K by LFA (Laser Flash Analysis) and a dielectric constant of 4.6@10 GHz by SPDR (Split Post Dielectric Resonators)
In order to improve the properties of the polyimide composite, graphene and BN filler were compounded
Summary
Polyimide is the main material for flexible printed circuit board. It has a high operating temperature system. If the ambient temperature rises, both transfer rate and durability deteriorate rapidly [1]. The use of thermal conductive materials is important. The electric devices require a high transfer rate at high frequency. The faster transfer rate can be achieved by lowering permittivity.
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