Study of defect mechanisms in partly filled stamp cavities for thermal nanoimprint control

Abstract

Self-assembly defects limit the suitability of partial cavity filling in thermal nanoimprint for residual layer minimization. As they represent thermodynamically stable structures already the formation of such defects has to be avoided—because once developed they cannot be removed. One impact parameter for the formation of self-assembly defects is the quality of the stamp surface, in particular its roughness. The authors compared stamps with flat surfaces obtained by potassium hydroxide etching of (110)-Si with stamps prepared by dry-etching, featuring vertical grooves or horizontal scallops (typical of deep-etching in a Bosch process). Under comparable conditions, the stamps with the vertical grooves feature the highest amount of self-assembly defects. In contrast, horizontal scallops avoid defect formation. Thus, the surface quality of the stamp sidewalls is important for a high quality imprint.