Abstract
Recrystallization of polycrystalline silicon (poly-Si) film by excimer laser annealing (ELA) is discussed by considering the experimental results that the three stages of nucleation, textured grain growth and secondary grain growth were observed. Although the phenomenon of nucleation in the amorphous silicon (a-Si) is understood by considering crystallization from the super cooled liquid, the growth mechanisms of the textured grain and secondary grain are not understood by this, because the melting point of poly-Si which has already been formed on the entire surface during these growth stages is higher than that of a-Si. The recrystallization mechanism considering the dislocation movement is introduced to investigate the present phenomenon. It also clarifies the reason why secondary grain growth occurs under the critical conditions of laser irradiation energy and shot number. The feasibility of nucleation through the super cooled liquid is also discussed.
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