Abstract
The kinetics of anodic reactions occurring on copper in thiocarbamide-citrate solutions was studied. Thiocarbamide forms stable copper (I) complexes of the cationic type with a coordination number equal to unity. Citric acid ensures acid pH value of electrolyte and causes active dissolution of copper under conditions of anode polarization. The joint presence of CS(NH 2 ) 2 and C 6 H 8 O 7 in the solution contributes to the copper electrode activation under conditions of anodic polarization. Increasing the concentration of thiocarbamide leads to a drastic shift of copper dissolution potentials towards the region of negative values. Study of the kinetics of anodic behavior of copper by acquiring the voltammograms revealed the nature of the limiting stage of reaction. It is shown that the process of dissolution in a thiocarbamide-citrate electrolyte is controlled by the diffusion phase. This is confirmed by the results of graphical processing of polarization dependences in coordinates η–lg(1–j a /j d ). An increase in υ р within 5‒100 mV·s –1 causes an increase in j d from 2.2 to 12.0 mА·cm –2 , which indicates diffusion control over the process. The process of copper dissolution proceeds under stationary mode with uniform etching of intragrain boundaries and volume of the metal's grain.
Highlights
Copper plating is one of the most common processes for applying coatings in electroplating engineering
We have examined influence of the composition of a complex electrolyte on copper dissolution under conditions of anodic polarization
It was established that thiocarbamide contributes to the formation of stable complexes of copper (I) in a solution
Summary
Copper plating is one of the most common processes for applying coatings in electroplating engineering. To apply coatings to steel products, as well as to parts with complex shape, complex electrolytes of copper plating are used, the most common of which are the cyanide electrolytes. Disadvantages of cyanide electrolytes (instability of composition and high toxicity) stimulate the development of other complex electrolytes for copper plating. Such electrolytes must meet the following requirements: 1) to ensure application of high-quality coatings with durable adhesion to the base; 2) to have a stable composition; 3) to be suitable for operational use and to be non-toxic; 4) preparation of the electrolyte must include widespread and cheap components. Electrolyte components should be affordable and harmless for the environment
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More From: Eastern-European Journal of Enterprise Technologies
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