Abstract
Currently, in the assembly process of the electronic device occupies much trouble by CDM.CDM test is done after the package assembly. Therefore, if it failed by CDM test, it would be to spend a lot of time and cost from design changes to assembly. In recently, HBM test is possible to measure on the Wafer, it is possible to design changes before the assembly of the package. However, CDM test cannot be tested on the Wafer. In this study, it has performed an investigation and report to the test method of Small Capacitor Model on the Wafer is whether the place of the CDM test.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
