Abstract
In the present work, the adhesive strength of the surface alloy with different transition layer thickness was measured. A Ni-Cu surface alloy is formed using successive operations of Ni film deposition followed by mixing in a melted phase with the Cu substrate by a low-energy, high-current electron beam (LEHCEB). A different thickness of the transition layer was obtained by varying the thickness of Ni film deposited during the formation of the surface alloy. The study includes characterization of formed Ni-Cu surface alloys by scanning electron microscopy, in-depth elements distribution and scratch test. The results obtained showed correlation with thickness of the transition layer and adhesive strength of the surface alloy.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
