Abstract
In the present work, the adhesive strength of the surface alloy with different transition layer thickness was measured. A Ni-Cu surface alloy is formed using successive operations of Ni film deposition followed by mixing in a melted phase with the Cu substrate by a low-energy, high-current electron beam (LEHCEB). A different thickness of the transition layer was obtained by varying the thickness of Ni film deposited during the formation of the surface alloy. The study includes characterization of formed Ni-Cu surface alloys by scanning electron microscopy, in-depth elements distribution and scratch test. The results obtained showed correlation with thickness of the transition layer and adhesive strength of the surface alloy.
Published Version
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