Abstract
The effects of copper deposition with three different additives were studied, which are triethanolamine, selimium dioxide and allylthiourea in citrate electrolyte. SEM (scanning electron microscopy) was used in the investigation of surface structures formed in the course of processing. The cathode polarization test was to tell the influence of different components and electroplating conditions to the plating system. Through orghogonal experiments, it was observed that the best additive combination is triethanolamine 3ml/l, selimium dioxide0.012g/l and allylthiourea0g/l.
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