Abstract

An investigation of the structures and design parameters of 4H–SiC trench inversion-channel MOSFETs using a two-dimensional (2D) numerical device simulation is presented. Material parameters have been adjusted appropriately for the 4H–SiC polytype and a systematic characterisation and optimization of a specific trench MOSFET with a 1.2 kV blocking voltage capability has been performed. Simulations have concentrated on optimizing the p-type doping concentration at the trench bottom, to keep the breakdown electric field in the oxide under its critical value. The trench depth was also examined and optimized to give a better on-state performance. For the MOSFET structure examined, a minimized on-state resistance of 53 mΩ cm 2 was obtained.

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