Study Concerning the Influence of the Grinding Percentage on Some Electrical Properties of PA 6.6, POM and ABS by Methods for Determining Relative Permittivity and the Dielectric Dissipation Factor

Abstract

This paper presents the influence of the grinding percentage on some electrical properties, when the process of injection is used in the production of technical commodities, made of polyamide 6.6 (PA 6.6), polyoxymethylene (POM) and acrylonitrile butadiene styrene (ABS), for different industries. The specimens produced had the following compositions: new material 100%, new material 80% + grinding 20%, new material 60% + grinding 40%, new material 40% + grinding 60%, new material 20% + grinding 80% and 100% grinding. The measurement of the electrical properties was carried out using the methods for the determination of relative permittivity and of the dielectric dissipation factor, with the method of zero by Schering bridge. It was found that increasing the percentage of grinding in samples, from 0% to 100%, determined a slight increase in the values of relative permittivity at all three polymers tested and the increase of measurement frequencies for acrylonitrile butadiene styrene and polyoxymethylene led to insignificant changes in the values of relative permittivity, while in the case of polyamide, increasing the measurement frequency led to a slight decrease in the values of relative permittivity. It was also found that increasing the proportion of grinding in the specimens, from 0% to 100%, determined a slight increase in the values of the dielectric dissipation factor in the case of polyamide and polyoxymethylene, while in the case of acrylonitrile butadiene styrene increasing the percentage of grinding in the samples resulted in insignificant changes. The increase in the measurement frequencies for the three tested polymers resulted in a decrease in the values of the dielectric dissipation factor.