Abstract

With the growing of the applications of surface acoustic wave (SAW) devices, the requirement for the accuracy of the operating frequency of the SAW devices is constantly strengthened. The impact of thermal strain on the characteristics of SAW devices cannot be ignored, which induced in their packaging process. In this paper, by using the finite element method (FEM) software, the thermal strain induced in the F-11 package structure of a SAW device is analyzed. An approach to reduce the thermal strain induced in the device chip by setting a ring configuration around it is explored. And the effects of various ring structures with different materials, thicknesses, widths and other parameters for reducing the thermal strain on the chip surface are analyzed and compared.

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.