Abstract
Thermal properties of control phenol formaldehyde (cpf) adhesive and lignin substituted phenol formaldehyde (lpf) adhesives have been investigated in detail. The effect of varying lignin mass percent of phenol and source of lignin like bagasse, eucalyptus bark, coconut coirpith and coffee bean shell on the thermal stability have been studied using thermogravimetric analysis (TG) and differential scanning calorimetry (DSC). 50 mass% of lignin loading in cpf adhesive shows better bond strength, whereas lignin incorporation up to 25 mass% yields a resin of thermal stability comparable to cpf. Loading of lignin in cpf delays the first thermal transition event. The mass loss in this event was found to increase with increasing lignin content. Lignin source has significant effect on the thermal stability of lpf resins. Rate of curing is enhanced by incorporation of lignin into cpf.
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