Abstract

Photo Chemical Machining (PCM) is one of the well known non-conventional machining techniques. This technique is similar to those employed for the production of printed boards, silicon integrated circuits, microchannels on metals, wide range of precision metal parts, decorative items, etc. Excimer laser ablation has been widely used in the fabrication of miniature polymeric parts viz. Micro-lens arrays, textured surface on the polymers, microchannels, which find potential applications in various industries. In projection lithography by excimer laser a thin metal mask is used which is generally made by PCM. This metal mask is made larger and the laser lithography is done through reduction optics to increase the resolution. If the metal mask contains lines or features of varying width, then it becomes difficult to apply same etch factor correction in the CAD artwork of the phototool. This work present a systematic study of the errors introduced in metal mask manufacturing at various stages of PCM process. An attempt has also been made to experimentally estimate the depth caused by the laser ablation at two different fluence levels and also understand the mechanism of laser ablation of polymers.

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