Abstract
A novel tri-phthalonitrile phenyl polyhedral oligomeric silsesquioxane (TPnPh-POSS) was synthesized from trisilanol phenyl POSS and 4-nitrophthalonitrile. The structure of the TPnPh-POSS monomer was characterized by Fourier transform infrared spectroscopy and nuclear magnetic resonance spectroscopy. The phthalonitrile monomer was thermally polymerized with various concentrations (3, 4, and 5 wt%) of 4,4′-diaminodiphenyl sulfone (DDS) as the curing agent. The curing behavior of the monomer was investigated by differential scanning calorimetry. The influence of the content of the curing additive on the polymer properties was studied. Blends of TPnPh-POSS and diglycidyl ether of bisphenol A (epoxy resin) were successfully prepared. The thermal and mechanical properties of these blends with DDS as curing agent were evaluated and compared with the neat epoxy resin. The thermal stability of the cured polymers and epoxy/TPnPh-POSS blends was studied by thermogravimetric analysis. Dynamic mechanical analysis and dielectric studies indicate the influence of TPnPh-POSS content on the relaxation behavior of the prepared blends. The blends exhibit high glass transition temperatures, high storage modulus, and increased thermal stability compared with the commercially available neat epoxy resin. Noncrystalline nature of the cured polymer (with 5 wt% of DDS) was confirmed by X-ray diffraction analysis. The cured polymer shows high flame retardancy, which improved with increase in the amount of the curing additive.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.