Abstract

Stripping voltammetry and conductance measurements were used for the first time to study the corrosion and inhibition of copper. The effect of nitric acid concentration, temperature and some organic compounds on the corrosion rate was studied. Regression analysis using four modes (linear, logarithmic, power and exponential) was used to correlate the results. Data obtained showed that the linear regression is the best to fit the relationship between Cu 2+ concentration–time (stripping voltammetry) and conductance–time (conductance measurements). The inhibition efficiencies of the organic substances during the active stage of copper dissolution are generally lower than in the incubation period. The increase in temperature and nitric acid concentration brought about a parallel increase in the corrosion rate. Galvanostatic polarization measurements, using simple circuit, were used to study the corrosion process of copper in nitric acid.

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