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Abstract
The methods of electrochemical anodic dissolution and transmission electron microdiffraction have been used to study the kinetics of the interaction and composition of intermetallic compounds in the Al/Ni, Al/Cr and Al/(Ni-Cr alloy) thin film systems widely used in integrated circuits. The formation of the same intermetallic compounds, NiAl 3, Ni 2Al 3 and NiAl, has been found in both Al/Ni and Al/(Ni-Cr alloy) thin films with activation energies of 1.6±0.1 eV and 2.2 ±0.1 eV respectively. In addition, for Al/Ni-Cr the interactions occur at higher temperatures and the formation of nickel aluminides results in alloy decomposition followed by the formation of a layer of polycrystalline chromium.
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