Abstract
The effects of annealing on some structural parameters of electroplated and vapor-deposited copper films have been investigated by x-ray diffraction and electrical resistivity measurements. The results can be described in terms of two annealing stages. Stage I, occuring only in electroplated films in the temperature range 25–200°C, is characterized by annealing out of twins due to the diffraction and electrical resistivity measurements. The results can be described in terms of two molecules. Stage II, occuring above 200°C, is characterized by annealing out of dislocations and growth of particle sizes. The kinetics of the annealing stages are discussed.
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