Structure Design and Properties of Three-Layer Particleboard Based on High Voltage Electrostatic Field (HVEF)

Abstract

In this study, the effects of three different particle sizes of wood wastes (A = –8 + 12 mesh; B = –12 + 20 mesh; C = –20 + 30 mesh) and factory shavings (D) on the properties of particleboard were investigated. According to the test results, three-layer particleboard was designed. Particleboard face layers made with mixture of A, B, and C. The core layer made with D. The ratio of core layer to face layers is 50:50. Three-layer particleboard were fabricated with 12% urea-formaldehyde (UF) resins and three different high voltage electrostatic field intensities (0 kv, 30 kv, 60 kv). The internal bond (IB) strength, modulus of rupture (MOR), modulus of elasticity (MOE), thickness swelling (TS), and water absorption (WA) of particleboard were evaluated. The density distribution of the three-layer particleboard were examined by vertical density profiles (VDP), and the bonding mechanism and functional groups changes in the particles were analyzed by FTIR analysis. The results showed that HVEF treatment intensity play a remarkable role in properties of particleboard. The particleboard with higher electrostatic field intensities treatment has higher MOE, MOR, IB, and TS. Under HVEF treatment (60 kv), the MOR, modulus of MOE, and IB of three-layer particleboard were 23.61 N/mm², 2787.09 N/mm², and 0.86 N/mm², respectively. FTIR indicated that the surface activity of wood particles was increased electric field treatment.