Structure and Thermal Expansion of Cu−90 vol. % Graphite Composites

Abstract

Copper–graphite composites are promising functional materials exhibiting application potential in electrical equipment and heat exchangers, due to their lower expansion coefficient and high electrical and thermal conductivities. Here, copper–graphite composites with 10–90 vol. % graphite were prepared by hot isostatic pressing, and their microstructure and coefficient of thermal expansion (CTE) were experimentally examined. The CTE decreased with increasing graphite volume fraction, from 17.8 × 10−6 K−1 for HIPed pure copper to 4.9 × 10−6 K−1 for 90 vol. % graphite. In the HIPed pure copper, the presence of cuprous oxide was detected by SEM-EDS. In contrast, Cu–graphite composites contained only a very small amount of oxygen (OHN analysis). There was only one exception, the composite with 90 vol. % graphite contained around 1.8 wt. % water absorbed inside the structure. The internal stresses in the composites were released during the first heating cycle of the CTE measurement. The permanent prolongation and shape of CTE curves were strongly affected by composition. After the release of internal stresses, the CTE curves of composites did not change any further. Finally, the modified Schapery model, including anisotropy and the clustering of graphite, was used to model the dependence of CTE on graphite volume fraction. Modeling suggested that the clustering of graphite via van der Waals bonds (out of hexagonal plane) is the most critical parameter and significantly affects the microstructure and CTE of the Cu–graphite composites when more than 30 vol. % graphite is present.