Abstract

AlN powders doped with Y 2O 3 (5 wt.%) were compacted by employing powder injection molding (PIM) technique. The binder consisted of paraffin wax (PW, 60 wt.%), polypropylene (PP, 35 wt.%) and stearic acid (SA, 5 wt.%). The feedstock was prepared with a solid loading of 62 vol.%. The binder was removed through debinding process in two steps, solvent debinding followed by thermal debinding. At last, the debound samples were sintered in flowing nitrogen gas at atmospheric pressure. The result reveals that thermal debinding atmosphere has significant effect on the thermal conductivity and structure of AlN ceramics. The thermal conductivity of injection molded AlN ceramics thermal debound in flowing nitrogen gas is 231 W m −1 K −1.

Full Text
Paper version not known

Talk to us

Join us for a 30 min session where you can share your feedback and ask us any queries you have

Schedule a call

Disclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.