Abstract
The paper reviews the influence of thermodiffusion copper plating of nickel-chromium stainless steel on the structure and strength properties of its soldered joint with copper. Technology features allow to obtain a functional coating with a developed microrelief which due to its higher roughness contributes to the increase in the solder flowing parameter over contact surfaces of the soldered couple due to the capillary effect. All this contributes to formation of a virtually defect-free solder structure in the soldered seam with a minimal dry joint area at its center, and makes it possible to obtain higher strength indices and tear resistance as compared to similar characteristics of a soldered specimen in the copper / copper combination.
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