Abstract
A methodology to characterize nanoporous thin films based on a novel combination of high-resolution specular X-ray reflectivity and small-angle neutron scattering has been developed. The average pore size, pore connectivity, film thickness, wall or matrix density, coefficient of thermal expansion, and moisture uptake of nanoporous thin films with nonhomogeneous solid matrices can be measured. The measurements can be performed directly on films up to 1.4 µm thick while supported on silicon substrates. Further advancements in the data analysis include the accommodation of additional heterogeneities within the material surrounding nanoscale voids. This method has been successfully applied to a wide range of materials under evaluation as candidates for low-k interlayer dielectrics.
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