Abstract
Vector 3-D magnetic sensors form the basis of measurement devices for magnetic field mapping and magnetic tracking. Typically, such sensors utilize specific constructions based on split Hall structures (SHS). An SHS-based 3-D magnetic sensor is a bulk semiconductor integrated structure with 8 or more contacts. Combining current flow directions through the contacts and measuring the corresponding voltages, one defines projections BX, BY, BZ of the magnetic field vector. This work presents a novel design of 3-D solid state magnetic sensors that requires no insulation by p-n junctions and can be implemented by thin-film technology traditionally used for fabrication of Hall sensors including those based on InSb films. Besides, a SPICE model of the 3-D magnetic sensor is provided, which helps design the proposed sensor and refine techniques of its calibration.
Highlights
Nowadays 3-Dimensions (3-D) magnetic sensors able to measure three mutually orthogonal components BX, BY and BZ of the magnetic flux density are of high interest
This work presents a new design of 3-D magnetic sensors that can dispense with p-n junctions and be implemented by thin-film technology traditionally used for manufacturing Hall sensors, including those based on InSb films
The work presents a new design of a 3-D magnetic sensor based on split Hall structures (SHS)
Summary
Nowadays 3-Dimensions (3-D) magnetic sensors able to measure three mutually orthogonal components BX, BY and BZ of the magnetic flux density are of high interest. Combining current flows through these electrodes and measuring the corresponding voltages, one defines projections BX, BY, BZ of the magnetic flux density vector Such an integrated 3-D sensor incorporates one component that serves as a traditional SHS whose sensitive axis (Z) is perpendicular to the semiconductor layer plane and two other components whose sensitive axes (X and Y) are parallel to the semiconductor layer plane. This work presents a new design of 3-D magnetic sensors that can dispense with p-n junctions and be implemented by thin-film technology traditionally used for manufacturing Hall sensors, including those based on InSb films Due to this one can create 3-D sensors resistant to harsh environments, for instance, for magnetic field diagnostics in thermonuclear fusion reactors or increased radiation in industrial disaster. The work proposes a SPICE model of a 3-D magnetic sensor which can be used when designing the proposed sensor and refining its calibration technique
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