Abstract
In order to further examine the effect of the addition of an excess amount of to solution on the morphological variation of copper film during electrodeposition carried out at relatively higher cathodic overpotentials, x‐ray diffraction patterns of the copper film were analyzed. The ratio of the relative intensity of a particular plane to that of the (111) plane was compared with that for the powder diffraction pattern. A significant difference in the diffraction patterns of electrodeposited film obtained in and solutions was noticed. The concentration profiles of Cu2+ and H+ ions formed near the vertical plane cathode under potentiostatic conditions were also measured by the two‐wavelength holographic interferometry technique. From these measurements, the surface overpotential was calculated. The structural and morphological variations of the copper film electrodeposited in both electrolytes with total overpotentials were considered.
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