Structural, thermal, morphological and dynamic mechanical characteristics of waste‐reinforced polypropylene composites: A novel approach for recycling electronic waste

Abstract

ABSTRACTAn in‐depth investigation has been carried toward utilizing polymer‐rich nonmetallic fraction of printed circuit boards (PCBs) as reinforcing fillers in polypropylene (PP) composites. The influence of waste additions (up to 25 wt %) on structural, thermal, morphological, and dynamic mechanical behavior of PP composites was investigated using a range of analytical techniques. The incorporation of PCB waste was found to affect the crystalline morphology resulting in the formation of smaller spherulites. The presence of glass fibers in PCB waste promoted the formation of β‐crystal enhancing the mechanical properties of composites. Thermal analysis showed a maximum increase of ∼15 °C in the crystallization onset temperature (Tco) suggesting the nucleating effect of the filler, a feature also supported by structural investigations. Polarized microscopy revealed a reduction in the spherulite size after 5 wt % PCB waste loading owing to the presence of large number of nucleation sites. The incorporation of waste also increased the thermal stability of composites increasing the final degradation temperature by up to 14 °C. Dynamic mechanical properties of PP/PCB waste composites were determined in the temperature range −20 to 155 °C; a significant increase in the storage modulus further confirmed the reinforcing effect of waste additives. This investigation has shown that the nonmetallic fraction of PCB waste could be used as a cost‐effective reinforcing filler for PP, providing an environmental friendly route to utilize electronic waste in value‐added products. © 2016 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2016, 133, 43389.