Abstract
Water cooling is an important technology for controlling the temperature of data centers. In this study evaluates the performance of newly designed cylinder-based and cuboid-based skeleton porous-medium heat exchangers for cooling a 80Wcm-2 high-power chip. The impact of the skeleton size, partial encryption, and porosity of the porous medium heat exchangers on the temperature control of the high-power chip was investigated using a non-isothermal multiphysics model self-contained in 6SigmaET. The results indicated that the skeleton size, encryption, and porosity of the porous medium heat exchangers significantly affected the average temperature, temperature distribution, maximum temperature difference, and pressure decrease within the chips. Porous medium heat exchangers with cylinder-based skeletons yielded higher performance rates than those with a cuboid-based skeleton with the same porosity. The partially encrypted cylinder-based skeleton porous medium heat exchanger with a porosity of 0.64 and a cylinder diameter of 0.5 mm exhibited the highest temperature control performance. In comparison with the conventional finned heat exchanger, the optimal porous medium heat exchanger decreased the maximum temperature by 19.62% and increased the uniform distribution of temperature by 23.38%.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
