Abstract
We report our research on X-ray micro-beam diffraction and coherent X-ray diffractive imaging techniques to study structural inhomogeneities in Silicon-On-Insulator continuous plain wafers. Inhomogeneities were measured quantitatively and attributed to limitations of the manufacturing process. 3-dimensional image reconstructions were performed by using our Error-Reduction and Hybrid-Input-Output iterative algorithms. These revealed images of the focussed X-ray beam passing through the active layer of the wafer.
Sign-in/Register to access full text options 
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
