Structural design of electronic equipment with frameless construction and blind mating connection

Abstract

With the continuous improvement of the functional performance demand of complex electronic equipment, the electronics on board are becoming more and more integrated. Traditional structure designs are becoming increasingly difficult to meet the requirements with harsh weight index. In this paper, a lightweight space-borne electronic device with blind insertion structure is designed. The conventional chassis frame structure is abandoned. By connecting to the backplane through blind connectors, the type and number of cable connections inside the electronic equipment are greatly reduced. It solves the main contradiction of equipment volume, weight and heat dissipation. The mechanical characteristics and thermal analysis of electronic equipment structure are carried out by finite element method. The corresponding structural deformation and stress distributions are obtained. The results show that, the electronic equipment meets the requirements of structural stiffness and thermal design. The structural design is reliable and safe.