Abstract
Bonding technology is a key step in the fabrication process of microfluidic chips. Bonding efficiency is one of the difficulties hindering the rapid mass production of microfluidic chips. In order to improve the bonding efficiency of polymer microfluidic chip bonding device. Analysis of process flow based on thermocompression bonding, the hot-pressing bonding device was designed and simulated. In the aspect of structural design: Creo software was used to establish a three-dimensional model, and the traditional heating method was changed to upper heating; Optimize process flow by adding gripper parts and chip library parts. The bonding efficiency was improved by 31.1%. In the aspect of simulation analysis, the model was imported into the simulation software ANSYS, and the influence of TEC location distribution, the thickness of thermal conductive adhesive and the thickness of thermal insulation layer on the temperature uniformity of the bonding zone were studied by numerical simulation. According to the simulation results, the optimal parameters are selected for experimental verification. The results show that this structure parameter can effectively improve the temperature uniformity and reduce the temperature difference in the bonding area to 0.5°C. It provides a new idea for the structural design and optimization of polymer microfluidic chip bonding equipment.
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