Abstract
The present study deals with TiN/Si bilayers irradiated at room temperature (RT) with 120 keV Ar ions. The TiN layers were deposited by d.c. reactive sputtering on Si(100) wafers to a thickness of ∼ 240 nm. After deposition the TiN/Si bilayers were irradiated to the fluences of 1 × 10 15 ions/cm 2 and 1 × 10 16 ions/cm 2. Structural characterization was performed with Rutherford backscattering spectroscopy (RBS), cross-sectional transmission electron microscopy (XTEM), grazing angle X-ray diffraction (XRD) and atomic force microscopy (AFM). The results showed that the variation of the lattice constants, mean grain size and micro-strain can be attributed to the formation of the high density damage region in the TiN film structure. It has been found that this damage region is mainly distributed within ∼ 100 nm at surface of the TiN layers.
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