Abstract
Methylsilsesquioxane (MSQ) based porous low-k dielectric films are characterized by x-ray porosimetry (XRP) to determine their pore size distribution, average density, wall density, and porosity. By varying the porogen content from 1% to 30% by mass, the porosity changes from 12% to 34% by volume, indicating that the base MSQ matrix material contains approximately 10% by volume inherent microporosity. The wall density of this matrix material is measured to be 1.33–1.35g∕cm3, independent of porosity. The average pore radii determined from the XRP adsorption isotherms increase from 6to27Å with increased porogen loadings. Small angle neutron scattering measurements confirm these XRP average pore radii for the films with porogen loading higher than 10% by mass.
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