Abstract
The microstructural characterization and properties of solder joints made from lead-free solder alloys SnAg3.0Cu0.5 and SnAg1.0Cu0.5Bi1.0 (composition given in weight %) with Cu plate were studied in this work. The influence of Bi addition to the SAC solder was studied. The melting temperatures, optical microscopy, EDX, and point chemical analyses were observed and evaluated. Thermo-Calc software was used for phase’s composition prediction. Altogether, 1500 cycles were carried out for the thermal cycling test in the range from +150 to − 40 °C where the solder joints’ reliability was assessed due to practice requirement. Optical microscopy and scanning electron microscopy (EDX microanalysis) tests were used for the evolution of microstructure and structural integrity of thermal cycled solder joints.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
