Abstract
The inside front cover highlights the breakthrough from rigid silicon-based magnetoelectronic devices to soft and compliant ones. On page 1333, M. Melzer, D. Makarov, and co-workers describe a method to transfer entire magnetoresistive microsensor structures from a rigid silicon substrate to a pre-stretched rubber membrane in a single step. This fabrication route overcomes several limitations of previous approaches to compliant magnetoelectronics and allows for invariance versus stretching up to 30%.
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