Abstract
Copper powder was electrodeposited from a solution containing copper sulphate and sulphuric acid. The stability of the powder, as measured by the resistance to oxidation, was assessed over a range of temperatures using a thermal balance. Similar powder was treated with an aqueous solution of benzotriazole, a specific corrosion inhibitor for copper, and also tested. Powder was also deposited from a standard bath containing benzotriazole and the properties of the powder determined. The use of benzotriazole was beneficial in improving the stability of the powder.
Talk to us
Join us for a 30 min session where you can share your feedback and ask us any queries you have
Schedule a callDisclaimer: All third-party content on this website/platform is and will remain the property of their respective owners and is provided on "as is" basis without any warranties, express or implied. Use of third-party content does not indicate any affiliation, sponsorship with or endorsement by them. Any references to third-party content is to identify the corresponding services and shall be considered fair use under The CopyrightLaw.
