Abstract

The kinetics of stressed solid-phase epitaxial growth (SPEG), also referred to as solid-phase epitaxy, solid-phase epitaxial regrowth, solid-phase epitaxial recrystallization, and solid-phase epitaxial crystallization, of amorphous (α) silicon (Si) created via ion-implantation are reviewed. The effects of hydrostatic, in-plane uniaxial, and normal uniaxial compressive stress on SPEG kinetics are examined in intrinsic (0 0 1)Si. Particular emphasis is placed on unifying the results of different experiments in a single-stress-dependent SPEG model. SPEG kinetics are observed to suffer similar exponentially enhanced growth rates in hydrostatic and normal uniaxial compressive stress. However, there are discrepancies between researchers in terms of the influence of in-plane stress on growth rates. Two different stress-dependent SPEG models are thus advanced, each with different physical bases. The model advanced by Aziz et al. proposes SPEG can be modeled as a single-atomistic process while the model advanced by Rudawski et al. suggests that stress influences the nucleation and migration processes of growth differently and that SPEG cannot be modeled as a single step. The basis for the Rudawski et al. model is based on the crystal island and ledge migration model of SPEG advanced by others. Morphological instabilities of the growing α/crystalline interface with in-plane compression are also addressed within the context of both the Aziz et al. and Rudawski et al. models. Finally, using the Rudawski et al. model, it is possible to examine, characterize, and isolate the different atomistic processes during growth. Calculation of the activation energies for nucleation and migrations processes suggests that the activation energy of 2.7 eV observed for the growth rate in stress-free SPEG by Olsen and Roth is representative of the activation energy for the single-atomistic process of crystal island nucleation. Thus, the study of stressed SPEG provides a new atomistic picture of the nature of growth.

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