Abstract

Stress relaxation tests in cantilever bending were performed on the C7025 and C7035 alloys at 298 K and 393 K, respectively. The effect of stress-relief treatments on stress relaxation properties was investigated. The structural changes associated with the stress relaxation process were examined using transmission electron microscopy. The stress relaxation curve fits well to empirical formula σ* = [K’ln(t + α0) + C]−n for stress relaxation. The curves can be split into two stages. The stress drops fast at first and then it gets slower in the second stage, and tends towards a certain limited value after a long time. The curve and microstructure reveal that the C7035 alloy has a lower rate of stress relaxation and a higher anti-stress relaxation capacity than the C7025. The first reason is that the movement of vacancies required by spinodal decomposition is inhibited, and the quantity of cobalt-containing vacancies decreases dramatically in the C7035 alloy. The other reason is that the precipitated phases became uniformly diffused in the C7035 alloy. The precipitate phase is uniformly distributed in the grain boundaries and the matrix, during the relaxed condition, and thus the dislocation movement is blocked by the precipitate.

Highlights

  • C7025 alloys are widely used in the fabrication of conductor components and lead frame materials due to their excellent strength and conductivity [1,2,3]

  • Fifty percent of the elastic limit stress was used to set the initial stress for stress relaxation tests

  • As temperature and aging time increased, the cellular structures formed by discontinuous precipitation in the grain boundaries, including in-growth intointo the in the C7025

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Summary

Introduction

C7025 alloys are widely used in the fabrication of conductor components and lead frame materials due to their excellent strength and conductivity [1,2,3]. Due to the effect of elastic beryllium and considered that the recovery and relaxation process was similar, which results in dislocation migration, rearrangement, and dislocation annihilation. It is important to characterize the exposure elevated but in microstructural changes The purpose of this laxation and stabilty performance of copper the alloy at room temperature. C7025 and stress of elastic copper alloy of in terms of the remaining stress after sure to elevated behavior temperatures, and in terms microstructural changes. C7035 alloys and attempt to ascertain the mechanism of microscopic deformation Thewith purpose of this is totopresent thetemperatures, results of lowbut temperature stress relaxation testschanges. C7035 isalloys to present the results of low temperature stress tests performed with C7025 and C7035 and attempt to ascertain the mechanism of relaxation microscopic deformation

Experimental
Calculation
Dynamic Equation of Stress Relaxation
Figures and
Before
After Stress Relaxation
Discussion
Conclusions
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