Stress Relaxation Empirical Model for Biaxially Strained Triple-Gate Devices

Abstract

Multiple gate devices provides short channel effects reduction, been considered promising for sub 20 nm era. Strain engineering has also been considered as an alternative to the miniaturization due to the boost in the carrier mobility. The stress non-uniformity cannot be easily considered in a TCAD device simulation without the coupled process simulation which is a cumbersome task. This work analyses the use of an analytical function to compute accurately the dependence of the strain on the device dimensions. The maximum transconductance gain and the threshold voltage shift are used as key parameters to compare simulated and experimental data.