Abstract
The microstructure of spinodally hardened, stress relaxation tested Cu–Ni–Sn alloys is characterized. The main mechanism of relaxation is recrystallization. At 150°C, initial stress values of 480–600 N mm −2 cause significant microstructural changes even if up to 90% of the initial stress remains after 1000 h of testing. Elevated temperature stability depends on the uniformity of deformation.
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